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Adhesive Solutions for Shock and Impact Resistance

Over the past decade, consumers have come to expect their electronic devices to withstand shock and impact which they may be subjected to on a day-to-day basis. Much of the device is bonded by tapes and other adhesives which play a large part in protecting the device from overall shock or impact. As devices become ultra thin and light, adhesives are expected to perform with thinner coatweights.

Avery Dennison Performance Polymers offers a portfolio of both solvent and emulsion acrylic adhesives for use in lens bonding and protection and component mounting applications. These adhesives provide bond integrity to a wide range of electronics substrates even at thinner coatweights. They can be modified with fillers and tackifiers to dampen at specific frequencies of impact.

In addition to standard adhesives, challenging shock and impact applications often require specifically formulated, customized adhesive solutions. Working closely with our customers, our scientists and engineers can quickly adjust existing adhesive platforms or develop new polymer systems to address the most complex challenges.

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At Avery Dennison Performance Polymers, our technical service and R&D teams bring together extensive Materials Science knowledge and polymer design and formulation. We combine our coating and converting know-how with a deep understanding of end-user applications. And, our team has the capability to quickly tailor and customize adhesives to provide the right solution to your unique application-driven challenges.

For more information about our shock and impact resistant pressure-sensitive adhesives for electronics applications, visit the product selector or contact our adhesive experts today.